Description of Zr Zirconium Sputter Target

Zirconium offers outstanding chemical stability, making it a go‑to deposition source for harsh‑environment functional coatings. During long‑run sputtering, inconsistent grain distribution can cause irregular erosion rates, which gradually drift your thin‑film parameters away from expected values. Our Zr zirconium sputter targets use carefully processed raw material to keep grain distribution uniform. These targets form adherent, corrosion‑tolerant thin films applied in medical component surface modification, high‑end optical stacks, and semiconductor device development. Every target goes through full dimensional auditing and surface condition checks before packing. Fit for lab‑scale sputter chambers as well as pilot manufacturing coating lines. Reliable sputtering performance reduces parameter drifting over extended working cycles, letting you gain stable, repeatable coating results for your demanding industrial and material research programmes.

Features of Zr Zirconium Sputter Target

1. High-purity zirconium sputter target material  

2. Dense grain for uniform film deposition  

3. Excellent corrosion resistance in coatings  

4. Custom sizes for all sputtering systems  

5. Ideal for optical and decorative layers 

6. Low impurity for semiconductor-grade films 

7. Suitable for DC and RF magnetron  

8. Supplied with full material certification  

9. Vacuum-sealed to prevent contamination 

10. Reliable performance for R&D and scale-up

Applications of Zr Zirconium Sputter Target

Decorative coatings: Used in consumer electronics, bathroom fixtures, jewelry, and more; these produce decorative finishes—such as gold or black—that combine aesthetic appeal with wear resistance.

Functional coatings: Leveraging zirconium's excellent corrosion resistance and its ability to form ceramic compounds with carbon and nitrogen, these coatings are used in applications such as tool coatings, optics, and semiconductors.

Specifications of Zr Zirconium Sputter Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Purity: 2N(99%), 3N(99.9%), 3N5(99.95%).

Process: Hot isostatic pressing (HIP), vacuum melting, or powder metallurgy are used, with a density>99% and uniform grain size.