Description of Round 3N5 Hf Sputter Target

Circular hafnium sputter targets are widely adopted for standard magnetron sputtering systems, yet round geometries bring unique processing challenges. Non‑uniform grain spread across circular surfaces can trigger localized over‑erosion, causing uneven film thickness and shortening effective target service life during continuous deposition cycles. Our round 3N5 Hf sputter target is manufactured from 3N5 high‑purity hafnium with carefully homogenized grain structure across the full circular face. It delivers low‑impurity hafnium thin‑films ideal for semiconductor barrier layers, high‑temperature resistant coatings, and diverse material research projects. Every target passes purity checks, dimensional measurement, and thorough surface quality assessment before delivery. Perfectly matched for common circular sputtering cathodes used in labs and pilot production. Balanced material performance slows uneven wear, helping you achieve steady, repeatable thin‑film results throughout your coating development work.

Features of Round 3N5 Hf Sputter Target

1. Round 3N5 hafnium for sputtering  

2. High‑purity Hf for advanced films  

3. Precision round shape for standard guns  

4. Excellent thermal stability for plasma  

5. Ideal for semiconductor and optical coatings  

6. Dense target for uniform deposition  

7. Low impurity for device‑grade layers  

8. Suitable for DC and RF magnetron  

9. Supplied with analysis certificate  

10. Vacuum‑sealed for oxidation protection

Applications of Round 3N5 Hf Sputter Target

Semiconductor Industry: Used to produce hafnium oxide (HfO₂) high-k dielectric thin films—a core material for gate dielectric layers in advanced-node chips—as well as for barrier and contact layer deposition.

Optics and Coatings: Used to create high-temperature-resistant oxide coatings for applications in extreme environments, such as rocket engine nozzles and spacecraft thermal protection systems.

Nuclear Industry: Leveraging hafnium's neutron-absorbing properties, related thin films and materials are used in nuclear reactor control components.

Specifications of Round 3N5 Hf Sputter Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 2N(99%), 3N(99.9%), 3N5(99.95%).