Description of Rectangular Hf Hafnium Sputter Target

Rectangular hafnium sputter targets bring unique demands for large‑area deposition, where grain inconsistencies often cause uneven edge erosion and thickness variation across substrates. Hafnium’s excellent thermal stability and chemical inertness make it highly sought‑after for high‑reliability thin‑film systems, yet poor target microstructure can undermine batch‑to‑batch reproducibility. Our rectangular Hf hafnium sputter target is processed with tightly managed grain distribution across the full rectangular surface. It generates robust hafnium‑based films widely applied for semiconductor barrier structures, high‑temperature resistant coatings and advanced material research. Every unit receives full dimensional verification and surface finish inspection before packaging. Built to fit standard rectangular sputter cathodes for lab and pilot‑scale equipment. Well‑balanced material behaviour minimises thickness deviations over long deposition runs, supporting consistent test data for your high‑performance thin‑film development projects.

Features of Rectangular Hf Hafnium Sputter Target

1. Rectangular hafnium for large-area deposition  

2. High-purity Hf for advanced thin films  

3. Excellent thermal stability for high-power use  

4. Ideal for semiconductor and optical coatings  

5. Custom sizes for in-line sputtering systems  

6. Low impurity for device-grade performance  

7. Dense microstructure for uniform erosion  

8. Suitable for DC and RF magnetron sputtering  

9. Supplied with full purity certificates 

10. Vacuum-sealed for oxidation protection

Applications of Rectangular Hf Hafnium Sputter Target

Semiconductor manufacturing: Used for depositing hafnium oxide gate dielectric thin films in advanced process nodes and for preparing barrier layers; research into the ferroelectric properties of doped hafnium-based thin films for ferroelectric RAM (FeRAM) is a growing area of interest.

Optical coating: Used for optical lenses, decorative coatings, and more.

Nuclear industry: Hafnium exhibits excellent thermal neutron absorption capabilities.

Plasma cutting: Hafnium wire serves as an electrode emitter, offering superior service life and cut-surface finish compared to traditional materials.

Specifications of Rectangular Hf Hafnium Sputter Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”, 0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 2N(99%), 3N(99.9%), 3N5(99.95%), 4N(99.99%).

Usage Precautions

Pre-sputtering (burn-in) is required prior to the actual sputtering process to remove surface-adsorbed moisture, organic contaminants, and metal oxide layers; failure to do so may compromise thin-film quality.

Hafnium targets react directly with oxygen and nitrogen at high temperatures; they must be packaged and stored in an inert atmosphere to prevent oxidation.

The target material typically requires bonding to a backing plate (made of oxygen-free copper, molybdenum, or stainless steel) to ensure effective heat dissipation and secure mounting.