C Carbon Sputtering Target
C Carbon Sputtering Target
C Carbon Sputtering Target
Previous
Next

C Carbon Sputtering Target

Description of C Carbon Sputtering Target

Carbon sputtering targets bring unique challenges in vacuum coating. Poor density or uneven material texture often leads to unwanted particle shedding, which contaminates substrates and ruins coating runs. Our carbon sputtering targets utilise well‑densified starting material to keep particle generation low throughout deposition cycles. Capable of depositing hard carbon‑based thin films, these sources are widely used for tribological protective layers, carbon‑based sensor structures and semiconductor research work. Each target goes through careful surface inspection and dimensional validation before it leaves our facility. Suited for small‑scale lab trials as well as pilot coating operations. Reliable material quality helps you get consistent deposition performance, cutting down sample scrap and supporting steady progress for your advanced thin‑film development projects.

Features of C Carbon Sputtering Target

1. High-purity carbon for precision sputtering 

2. Dense graphite structure for stable discharge  

3. Ideal for hard and protective films  

4. Custom dimensions for various sputter systems 

5. Excellent thermal stability for high power  

6. Low outgassing for clean vacuum processing  

7. Suitable for DC and RF magnetron  

8. Supplied with purity and density certificates  

9. Vacuum-sealed to prevent contamination  

10. Fast delivery for research and production

Applications of C Carbon Sputtering Target

• Electronics

• Semiconductor

• Flat panel displays

Specifications of C Carbon Sputtering Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 2N(99%), 3N5(99.95%), 4N(99.99%), 4N5(99.995%),5N(99.999%).6N(99.9999%).

Manufacturing Process of C Carbon Sputtering Target

• Refining

  Three-layer electrolytic process

• Melting and casting

  Electrical resistance furnace - Semi-continuous casting

• Grain refinement

  Thermomechanical treatment

• Cleaning and final packaging - Cleaned for use in vacuum

  Protection from environmental contaminants

  Protection during shipment

Quick Inquiry