C Carbon Sputter Target
C Carbon Sputter Target
C Carbon Sputter Target
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C Carbon Sputter Target

Description of C Carbon Sputter Target

Carbon remains a highly sought‑after deposition material thanks to its distinctive mechanical properties and chemical inertness. Many coating teams struggle with targets that show unstable erosion patterns over runtime, shifting film uniformity as sputtering continues. Our C carbon sputter targets are manufactured with carefully controlled bulk texture to promote even erosion across the target surface. They generate functional carbon‑based thin‑films suitable for mechanical wear‑resistant finishes, biosensor substrates and diverse vacuum‑based material studies. Each target undergoes strict dimension auditing and surface finishing evaluation before packing. Adaptable to both small lab sputter systems and intermediate pilot coating setups. Well‑controlled material behaviour keeps erosion progression steady through your coating cycles, lowering unexpected variable film performance and helping you gather trustworthy data for your material research and applied coating development initiatives.

Features of C Carbon Sputter Target

1. High-purity carbon sputter target material  

2. Dense graphite for uniform thin films  

3. Excellent thermal stability during sputtering  

4. Low outgassing for high-vacuum processes  

5. Ideal for DLC and conductive coatings  

6. Custom diameters for various gun sizes  

7. Suitable for DC and RF magnetron  

8. Supplied with material test certificates  

9. Vacuum-sealed for immediate use 

10. Reliable performance for R&D and production

Applications of C Carbon Sputter Target

Magnetic Data Storage: Used to produce magnetic thin films with granular structures (such as Fe-Pt systems), where controlling the dispersion state of carbon enhances magnetic properties. Relevant patents specify that the ratio of Raman spectral peak intensities (IG/ID) for the G-band and D-band must be below 5.0 to ensure high density and minimize issues related to sputtered particles.

‌Semiconductors and Electronic Devices: Utilized in integrated circuit manufacturing as conductive layers, protective layers, or mask materials, leveraging the stability and corrosion resistance of carbon thin films.

‌Optics and Surface Engineering: Employed to produce wear-resistant and corrosion-resistant coatings, thereby improving the surface properties of workpieces.

Specifications of C Carbon Sputter Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 2N(99%), 3N5(99.95%), 4N(99.99%), 4N5(99.995%),5N(99.999%).6N(99.9999%).

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