Description of C Carbon 99.99% Pure Sputtering Target

Our C Carbon 99.99% Pure Sputtering Target addresses typical hurdles in carbon thin-film deposition. Lesser-grade carbon targets frequently have porous structures that shed particles, introducing contamination and creating uneven films that compromise your lab samples. We use ultra-high-purity carbon powder and optimized forming treatments to create a dense, homogeneous target body. This refined microstructure reduces particle flaking during sputtering, supporting reliable carbon layers for tribological protective coatings, semiconductor hard masks, and carbon material R&D. Each target undergoes purity and surface quality checks before delivery. Standard sizes are offered, and backing plate bonding service can be provided for stable chamber operation. Custom geometries are also available to fit your PVD system. Reduce wasted substrates from particle defects, so you can dedicate more lab time to collecting consistent surface and tribology data for your coating projects.

Features of C Carbon 99.99% Pure Sputtering Target

1. High-purity graphite for quality films 

2. Dense target for stable deposition 

3. Ideal for DLC and conductive coatings  

4. Custom sizes for R&D systems 

5. Excellent thermal shock resistance  

6. Low impurity for consistent results  

7. Suitable for DC and RF magnetron  

8. Supplied with purity certificate 

9. Vacuum-sealed for contamination control

Applications of C Carbon 99.99% Pure Sputtering Target

Semiconductor Manufacturing: Used in Physical Vapor Deposition (PVD) processes for chip fabrication to deposit functional thin films, such as conductive layers.

New Energy & Displays: Applied in sectors including solar photovoltaics, flat-panel displays, and specialty coatings.

Scientific Research & Micro/Nano-fabrication: Serves as a sputtering source material for scientific experiments, micro/nano-fabrication, and device manufacturing.

Specifications of C Carbon 99.99% Pure Sputtering Target

Circular Sputtering Targets (Diameter): 1.0”, 2.0”, 3.0”, 4.0”, 5.0”, 6.0” up to 21”

Rectangular Sputtering Targets (Width x Length): 5” x 12”, 5” x 15”, 5” x 20”, 5” x 22”, 6” x 20”

Thickness: 0.125”, 0.25”

Shape: Disc/Rectangular

Bonding: Unbonded/Bonded

Purity: 4N (99.99%)

Purchasing Guidelines

Manufacturing Process: Typically involves hot isostatic pressing (HIP) and graphitization to minimize impurities and enhance purity.

Quality Inspection: Key parameters include purity (verified via ICP-MS), density, hardness, electrical conductivity, and microstructure.