Description of B Boron Sputtering Target

Elemental boron brings unique advantages for specialty thin‑film work thanks to its doping capability and neutron‑interacting characteristics. Yet elemental boron tends to feature porous microstructures; loose internal grain structures often trigger particle spitting under sputtering power, bringing contamination and inconsistent layer quality across substrate batches. Our boron sputtering target is manufactured with optimised consolidation processes to minimise internal voids and maintain uniform microstructure. It delivers clean boron‑rich thin‑films ideal for semiconductor doping applications, neutron‑related functional coatings and frontier material‑science research. Each target completes dimensional validation, microstructure spot‑checks and careful surface inspection before shipment. Suited for laboratory‑grade and pilot‑scale sputtering setups. Its stable physical behaviour cuts down particle‑related defects, letting you secure reproducible coating performance while advancing your high‑precision thin‑film projects.

Features of B Boron Sputtering Target

1. High-purity boron for advanced thin films  

2. Dense target for stable deposition

3. Ideal for semiconductor doping layers  

4. Excellent uniformity for optical coatings  

5. Custom sizes for R&D systems  

6. Low impurity for consistent results  

7. Suitable for RF and DC magnetron  

8. Supplied with purity analysis certificate  

9. Vacuum-sealed to prevent contamination 

10. Quick delivery for research projects

Applications of B Boron Sputtering Target

Semiconductor industry: Used for silicon doping to change the electrical properties of semiconductor materials; it is a key consumable in chip manufacturing.

Optoelectronic technology: As the basic material of optical thin films, it is used to manufacture various optical devices.

Nuclear industry and biomedicine: Utilizing the neutron absorption capacity of boron for nuclear reactor control materials; In radioactive isotope applications such as boron neutron capture therapy (BNCT), it can be used for targeted therapy of tumor cells.

Scientific research experiments: widely used in thin film preparation experiments such as magnetron sputtering and plasma deposition, suitable for DC/RF sputtering systems. ‌‌

Specifications of B Boron Sputtering Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 2N(99%), 3N5(99.95%), 4N(99.99%), 4N5(99.995%),5N(99.999%).