Tm3Fe5O12 99.9% Pure Sputtering Target
Tm3Fe5O12 99.9% Pure Sputtering Target
Tm3Fe5O12 99.9% Pure Sputtering Target
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Tm3Fe5O12 99.9% Pure Sputtering Target

Description of Tm3Fe5O12 99.9% Pure Sputtering Target

Our Tm₃Fe₅O₁₂ 99.9% Pure Sputtering Target solves typical pain points in magneto‑optical and magnonics thin‑film research. Many garnet targets struggle with poor phase homogeneity and stoichiometry variation during sputtering, leading to unstable magnetic responses and unrepeatable test data. We adopt high‑purity raw powders and precision sintering techniques to maintain the exact Tm‑Fe‑O stoichiometry throughout the ceramic body. The dense, uniform microstructure minimizes impurity inclusions and phase segregation, supporting consistent deposition of high‑quality thulium iron garnet films for spintronic studies and MO device prototyping. Each target passes XRD and composition inspection before dispatch. Standard dimensions are available, with backing plate bonding offered for steady sputtering performance. Custom sizes can also be manufactured to fit your PVD system. Reduce wasted substrate runs from inconsistent garnet material, and spend more lab hours collecting dependable magnetic and optical measurement results. 

Features of Tm3Fe5O12 99.9% Pure Sputtering Target

1. 99.9% pure thulium iron garnet 

2. High‑purity TmIG for magneto‑optic films  

3. Excellent Faraday rotation for isolators  

4. Ideal for near‑infrared photonic devices 

5. Dense ceramic for uniform sputter deposition  

6. Custom sizes for R&D and pilot runs  

7. Low optical loss for signal integrity  

8. Suitable for RF magnetron sputtering  

9. Supplied with full purity certification  

10. Vacuum‑sealed for contamination‑free handling

Applications and Precautions of Tm3Fe5O12 99.9% Pure Sputtering Target

Applicable equipment: various single/multi target sputtering systems, ion sputtering systems, and other magnetron sputtering equipment.

Application areas: scientific experiments, micro-nano processing, device manufacturing, widely used in semiconductor chips, solar photovoltaics, flat displays, special coatings, etc.

Storage requirements: Upon receipt, it should be stored in a dry environment, sealed in packaging, handled with care, and protected against pressure and collision.

Attention to use: Before use, check whether the surface of the target material is clean, wear clean gloves during operation, and avoid contamination by foreign objects such as oil stains. ‌‌

Specifications of Tm3Fe5O12 99.9% Pure Sputtering Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 3N(99.9%).

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