Description of B4C Boron Carbide Sputtering Target

Boron carbide stands out for exceptional hardness and neutron‑absorbing capability, making it a unique ceramic material for specialised thin‑film work. Porosity within sintered B4C targets frequently leads to particle spitting and surface cracking under RF power, contaminating substrates and compromising coating consistency in critical trials. Our B4C boron carbide sputtering target is produced under tightly controlled sintering conditions to lower internal porosity and maintain uniform bulk density. It deposits dense, hard protective films suitable for wear‑resistant surface coatings, neutron‑shielding layers and advanced material‑science research. Each target completes density assessment, dimensional verification and full‑surface inspection before leaving our facility. Compatible with RF magnetron sputtering for laboratory and pilot deposition systems. Improved structural stability suppresses particle generation, helping you achieve clean, repeatable film performance for your high‑spec coating development tasks.

Features of B4C Boron Carbide Sputtering Target

1. High‑purity boron carbide for sputtering

2. Extreme hardness for protective coatings  

3. Excellent neutron absorption properties 

4. Custom sizes for R&D systems  

5. Dense target for stable deposition  

6. Ideal for wear‑resistant thin films  

7. Low impurity for consistent results  

8. Suitable for RF magnetron sputtering  

9. Supplied with purity analysis certificate 

10. Vacuum‑sealed for contamination‑free use

Applications of B4C Boron Carbide Sputtering Target

Ultra-hard protective coatings: Used for surface strengthening of mechanical parts, cutting tools, and molds to enhance wear resistance.

Nuclear industry: Utilized for neutron shielding and control rod materials due to its high thermal neutron absorption capacity (e.g., 3M’s ¹⁰B-enriched boron carbide products).

Optical thin films: Used to produce infrared optical protective coatings, leveraging its infrared transparency.

Specifications of B4C Boron Carbide Sputtering Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 2N(99%), 2N5(99.5%).

⚠️ Key points for selecting and using B4C Boron Carbide Sputtering Target

Purity is critical: Excessive impurities can compromise film uniformity and adhesion; for demanding applications, high-purity targets (4N grade or higher) are recommended.

Consider microstructure: Target density and grain size affect sputtering stability and film quality, and significant variations may exist between products from different manufacturers.

Complex manufacturing process: Targets are typically produced via hot pressing or powder metallurgy; lead times can be long, so production capacity should be verified in advance for volume orders.