Description of 4N AlO2O3 Sputtering Target

Our 4N Al₂O₃ Sputtering Target addresses common issues when depositing dielectric thin films. Lower-quality alumina targets often have uneven density and inconsistent grain structure, which introduce particle contamination and shift insulating performance across your samples. We use high-purity alumina powder and precision sintering to create a dense, homogeneous target body. Tight impurity control keeps contaminants low, supporting stable sputtering for semiconductor gate dielectrics, protective coatings, and optical thin film research. Each target passes microstructure and purity inspection before shipment. Standard sizes are available, and backing plate bonding can be supplied for reliable chamber operation. Custom shapes and dimensions are also offered to fit your PVD equipment. Reduce wasted substrates caused by defective films, so you can focus on getting consistent, repeatable electrical and optical test data for your projects.

Features of 4N AlO2O3 Sputtering Target

1. 4N alumina for high-purity films 

2. Dense Al₂O₃ for stable sputtering 

3. Ideal for gate dielectric layers 

4. Excellent dielectric strength for devices 

5. Custom sizes for R&D systems 

6. Low impurity for consistent results 

7. Suitable for RF magnetron sputtering

8. Smooth films for optical applications

9. Vacuum-sealed for contamination control 

10. Reliable performance for semiconductor use

Applications of 4N AlO2O3 Sputtering Target

Semiconductors and Electronics: Used to prepare insulating and barrier layers in integrated circuits, it is an important material in chip manufacturing.

Optical Coating: Alumina thin films have good light transmittance in the visible light range and can be used for coating optical lenses, displays, etc.

Decorative and Protective Films: Utilizing its high hardness and wear resistance, it provides a protective layer for product surfaces.

Specifications of 4N AlO2O3 Sputtering Target

Circular Sputtering Targets (Diameter): 1.0” 2.0” 3.0” 4.0” 5.0” 6.0” up to 21”

Rectangular Sputtering Targets (Width x Length): 5” x 12” 5” x 15” 5” x 20” 5” x 22” 6” x 20”

Thickness: 0.125”, 0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 4N (99.99%).