Description of 3N5 Ga2O3 Gallium Oxide Sputtering Target

3N5 Ga2O3 Gallium Oxide Sputtering Target is developed for customers who need reliable gallium oxide material with stable sputtering performance and consistent film quality. Made from gallium oxide with 99.95% purity, it provides a dependable material source for semiconductor research, power electronics, optoelectronic devices, and advanced thin-film applications. In practical production and research environments, target consistency directly affects deposition stability and final film performance. This sputtering target is manufactured with controlled composition, uniform structure, and strict quality inspection to help minimize process fluctuations, material waste, and unexpected adjustments during sputtering operations. Unlike standard targets that focus only on purity values, the 3N5 Ga2O3 Gallium Oxide Sputtering Target is designed around real application needs, offering a balance between performance, cost control, and process reliability. Available in customized sizes and specifications, it can be adapted to different sputtering systems and development requirements. With stable material characteristics and dependable quality, it supports customers in achieving repeatable results for next-generation electronic and coating technologies.

Features of 3N5 Ga2O3 Gallium Oxide Sputtering Target

1. High purity material quality: Made from 99.95% pure gallium oxide (3N5), helping reduce impurities and support stable thin-film deposition processes.

2. Stable sputtering performance: Provides consistent sputtering behavior, helping maintain uniform film thickness and reliable coating quality during production.

3. Excellent material consistency: Controlled composition and uniform structure help minimize process fluctuations and improve repeatability.

4. Good process compatibility: Can be adapted to different sputtering systems and deposition requirements with customized dimensions available.

5. Reduced production uncertainty: Helps customers lower risks caused by target inconsistency, unstable deposition rates, and frequent process adjustments.

6. Reliable surface quality: Carefully processed target surfaces contribute to cleaner sputtering operation and improved film performance.

7. Customizable specifications: Available in various sizes, shapes, and bonding options to meet specific equipment and application needs.

8. Balanced performance and cost efficiency: Offers a practical solution for customers who require dependable gallium oxide targets without unnecessary material upgrades.

Specifications of 3N5 Ga2O3 Gallium Oxide Sputtering Target

Circular Sputtering Targets (Diameter): 1.0”, 2.0”, 3.0”, 4.0”, 5.0”, 6.0”, up to 12”

Rectangular Sputtering Targets (Width x Length): 5” x 12”, 5” x 15”, 5” x 20”, 5” x 22”, 6” x 20”

Thickness: 0.125”, 0.25”

Shape: Disc/Rectangular

Bonding: Unbonded/Bonded

Purity: 3N5 (99.95%)