Description of 99.95% Pure Co50Fe50 at% Sputter Target

Our 99.95% Pure Co50Fe50 at% Sputter Target tackles frequent alloy‑target headaches, including uneven element distribution, compositional drift and trace impurities that distort magnetic thin‑film characteristics. Advanced melting and homogenisation processes lock in the exact 50:50 atomic ratio across the entire target, keeping impurity levels firmly under control. Its consistent microstructure limits element segregation during sputtering, delivering repeatable magnetic properties from sample to sample. This makes it ideal for spintronics research, magnetic sensor prototyping and other lab‑scale material development. Every batch undergoes rigorous composition and purity verification to ensure your experimental data stays reliable and comparable. Multiple standard sizes are offered, alongside backing‑plate bonding for straightforward chamber installation. Custom geometries can also be produced to match your unique equipment requirements. Minimise costly trial‑and‑error caused by inconsistent alloy films, so you can focus more of your effort on advancing your core R&D objectives. 

Features of 99.95% Pure Co50Fe50 at% Sputter Target

1. 99.95% pure Co50Fe50 alloy target  

2. High-purity cobalt-iron for magnetic films  

3. Excellent soft magnetic properties 

4. Ideal for read/write head applications  

5. Dense target for uniform deposition  

6. Custom sizes for R&D and production  

7. Low impurity for device-grade quality  

8. Suitable for DC and RF magnetron 

9. Supplied with composition certificate 

10. Vacuum-sealed for contamination protection

Applications of 99.95% Pure Co50Fe50 at% Sputter Target

Magnetic recording and storage: hard disk drive (HDD) read-write heads, giant magnetoresistance (GMR)/tunneling magnetoresistance (TMR) devices, magnetic random access memory (MRAM) core layer.

Spintronics and sensors: magnetic sensors, spin-logic devices, thin-film magnetic shielding.

Semiconductors and Microelectronics: Metal interconnect, contact, or barrier layers in integrated circuits to reduce resistance and power consumption.

Aerospace and special devices: micro special motors, electromagnets, relays, etc., utilizing high saturation magnetic flux density to achieve lightweight and miniaturized design. ‌‌

Specifications of 99.95% Pure Co50Fe50 at% Sputter Target

Circular Sputtering Targets(Diameter): 1.0”2.0”3.0”4.0”5.0”6.0” up to 21”

Rectangular Sputtering Targets(Width x Length): 5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”

Thickness: 0.125”,   0.25”

Shape: Disc/Rectangular

Bonding: Unbonding/Bonding

Purity: 3N5(99.95%).